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dc.contributor.authorAlmeida, Rita Maria Cunha dept_BR
dc.contributor.authorGoncalves, Sebastianpt_BR
dc.contributor.authorBaumvol, Israel Jacob Rabinpt_BR
dc.contributor.authorStedile, Fernanda Chiarellopt_BR
dc.date.accessioned2014-10-09T02:13:09Zpt_BR
dc.date.issued2006pt_BR
dc.identifier.issn1098-0121pt_BR
dc.identifier.urihttp://hdl.handle.net/10183/104305pt_BR
dc.description.abstractIn a Comment on “Dynamics of thermal growth of silicon oxide films on Si” Phys. Rev. B 61, 12992 2000 , Roura and Farjas argue that the values of the kinetics parameters obtained from the model proposed in that paper are not reliable and that the solutions given for different partial pressures are erroneous. Moreover, that the solution from such model is unable to predict the oxidation rate experimentally observed in the thin oxide regime neither the width of the interface. Resorting to experimental results, and old and new results obtained from our model, we show in this Reply that none of the criticisms are solid and that the results of the original paper represent indeed an improvement over the Deal-Grove model. Finally, motivated by one of the issues raised by Roura and Farjas, we present here new fittings of experimental data using our model together with experimental estimates for the interface width between the oxide layer and the silicon substrate. This turned a two parameter fitting problem into a much simpler one parameter procedure.en
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.relation.ispartofPhysical review. B, Condensed matter and materials physics. Woodbury. Vol. 74, no. 12 (Sept. 2006), 127302pt_BR
dc.rightsOpen Accessen
dc.subjectFilmes finos : Crescimento : Tratamento térmicopt_BR
dc.titleReply to "Coment on dynamics of thermal growth of silicon oxide films on Si"pt_BR
dc.typeArtigo de periódicopt_BR
dc.identifier.nrb000558319pt_BR
dc.type.originEstrangeiropt_BR


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